Projects

Plasma Dynamics has worked both singly and as part of collaborative
groups. For the larger projects which Plasma Dynamics has undertaken,
it has assembled teams with complementary strengths. As such it has
established a network of experts and sub-contractors which allow
great flexibility in the scope of projects which it can undertake.

We list below some of the projects in which Plasma
Dynamics has been either the prime or sub-contractor.

• Development of 3D integrated microwave field, plasma, reacting fluid flow and surface chemistry simulation with application to deposition of SiO2 thin films
• Development and modelling of a novel large area reactor for the
  deposition of diamond thin films.
• Modelling of electrostatic fields for ESC applications
• Modelling of electrostatic field modifications due to
  grooves and features in electrostatic chucks.
• Modelling of ECR reactor for deposition of SiO_2 films
• Development of Monte Carlo charged particle simulation to model
  plasma flow in ECR reactor for $SiO_2$\ deposition.
• Modelling of microwave field pattern in commercial ECR etcher
• Development of 2D axisymmetric model for microwave cavity fields
  coupling into a magnetized plasma for arbitrary cavity geometry.
• Modelling of novel ECR source geometry
• 2D microwave field and charged particle
  Monte Carlo codes used to model novel ECR source geometry which
  leaves wafer accessible from above. Applications to combination
  plasma etch and neutral stream currently being pursued.
• Modelling of Electrostatic Chucks - Comprehensive chuck modelling project
  covering electrostatic fields, chucking, de-chucking,
  helium transport, arc formation, plasma effects due to structure at chuck
  edge, etc. Developed codes to simulate backside helium transport and 2D thermal profile of wafer for given groove design, 2D fluid plasma code to
  simulate phenomena occurring at wafer edge due to focus rings, steps, etc.
• Modelling of Microwave Reactors for Deposition of Diamond Thin Films - Development of 2D self-consistent, comprehensive simulation of
  microwave reactors for diamond thin film deposition. Includes
  microwave field solver including cold plasma response, analytic model
  for field plasma coupling and electron impact induced processes based
  on numerical solutions to Boltzmann equation, multi species diffusion,
  $H_2,\ CH_4,\ O_2$\ chemistry module, surface chemistry model, thermal
  conduction model and extensive diagnostics.
• Modelling of Very Large Area ECR Reactor for Deposition of SiN and SiC
  films
• Extension of Monte Carlo plasma code to incorporate
  neutrals. Modelling of deposition uniformity over very large areas
  (70 cm diameter) for applications in coating mirror blanks.
• Modelling of Neutral Stream Sources
• Data analysis of various neutral beam sources for
  etching.
• Modelling of Chemical Downstream Etchers
• Extension of 2D microwave plasma code to $CF_4,\ O_2,\ N_2,\ Cl_2$\
  chemistry. Data analysis to determine main physical effects in
  quartz tube erosion, thermal hotspot formation, source and transport
  tube chemistry and wafer chamber species transport.
• Modelling of ECR Reactor for etching SiN over GaAs
• Data analysis of processing results obtained by Raytheon, Inc.
  concerning the etching of SiN over GaAs, identification of GaAs
  damage mechanisms, incorporation of insulating boundary conditions
  and surface chemistry into Monte Carlo code.
• Modelling of ion sources for ion implantation
• Determining main physics and identifying source of ``hash'' in
  ion beam source
• Electrostatic chuck modelling-Modelling of helium distribution for various groove patterns.
• CMP modelling - Data analysis and development of conceptual models for underlying
  fundamental phenomena in CMP. Emphasis on identifying measurable
  quantities which could be used in conjunction with in situ
  diagnostics to increase polishing reproducibility and increase
  throughput.
• Modelling of High Density PVD Source using ECR Generated Plasma - Identification of main physical processes for novel designs applied to HDPVD
  sputter sources.

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